Choosing the correct passivation film can be a complicated task. Factors such as sidewall integrity, sodium penetrability, and ability to withstand postpassivation temperature cycles must be considered. Previous studies have defined standard techniques for testing sidewall integrity and sodium barrier ability. In this study, the effect of thermal cycle exposure on the sidewall integrity of plasma enhanced chemical vapor deposition (PECVD) passivation films (TEOS-based oxide, oxynitride, and nitride) by varying factors such as film type, metal sputter temperature, and film stress was examined. It will be shown that metal sputter temperature and film stress are much more important than film type. In addition, the newer generation of TEOS-based phosphorous-doped passivation films was compared to the standard, silane-based phosphosilicate glass which is deposited using atmospheric pressure chemical vapor deposition (APCVD). The conclusion is that APCVD films are slightly better as deposited, but degrade during temperature cycles. The newer TEOS-based PECVD films, however, are not affected by temperature cycling.