Previous Article Next Article Table of Contents Journal of Vacuum Science & Technology B, Vol.13, No.2, 198-202, 1995 DOI10.1116/1.587997 Export Citation Submicron Al Filled via Formation by High-Temperature Sputter-Deposition and via Electrical-Properties Nishimura H, Ogawa S, Yamada T Please enable JavaScript to view the comments powered by Disqus.
