Previous Article Next Article Table of Contents Journal of Vacuum Science & Technology B, Vol.13, No.3, 914-917, 1995 DOI10.1116/1.588205 Export Citation Effect of Co and CO2 Addition to the CF4/O-2 Gas System on the Etching of a Low-Pressure Chemical-Vapor-Deposition Tungsten Film Kwon SK, Kim KN, Nam CW, Woo SI Keywords:PLASMA;DISCHARGES;SILICON;OXYGEN;SF6 Please enable JavaScript to view the comments powered by Disqus.
