For V-shaped surface grooves in copper, we have obtained the capillary driven flow kinetics for two liquids : unreactive 1-heptanol and eutectic Sn/Pb solder, which is known to react with copper. We show experimentally that the flow of both liquids in these grooves follows the classical Washburn kinetics, i.e., a Poiseuille flow process, modified to include a dynamic contact angle. Because no subsidiary processes are necessary to fit our data, we propose that in this geometry capillary driven solder flow is too rapid for reaction to provide an appreciable effect. Thus, to observe the effects of Sn/Cu reaction kinetics, the flow rate must be decreased, which the present experiments allow through redesign of the groove geometry and size.