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Polymer, Vol.36, No.1, 5-11, 1995
Oxygen Plasma-Resistant Phenylphosphine Oxide-Containing Polyimides and Poly(Arylene Ether Heterocycle)S .1.
Phenylphosphine oxide-containing polyimides, poly(arylene ether 1,3,4-oxadiazole)s and poly(arylene ether benzimidazole)s were prepared and evaluated for resistance to an oxygen plasma. Thin films of the phenylphosphine oxide-containing polymers were exposed to a radiofrequency-generated oxygen plasma under vacuum along with Kapton(R) HN and polymers of similar chemical structure that did not contain the phenylphosphine oxide group. The stability of the materials to the oxygen plasma was assessed by monitoring the weight loss of the films as a function of exposure time. After 23 h oxygen plasma exposure the phenylphosphine oxide-containing polymers exhibited weight-loss rates that were 40 to 145 (1-2 orders of magnitude) times slower than that of Kapton(R) HN, whereas polymers of similar chemical structure that did not contain the phenylphosphine oxide group exhibited weight-loss rates about 1-3 times faster than that of Kapton(R) HN. The changes in surface chemistry of the exposed films were subsequently examined using X-ray photoelectron spectroscopy. The phosphorus and oxygen near the surface exhibited increases in relative concentration and the photopeaks shifted towards higher binding energies. These changes are indicative of the formation of phosphate-type species. In addition, limiting oxygen indices were calculated from char yields at 850 degrees C in nitrogen utilizing a known method. For the most part, the incorporation of the phenylphosphine oxide group did not substantially increase the limiting oxygen indices of these experimental polymers.