Poly(4,4＇-oxydiphenylene biphenyltetracarboxamic acid) was synthesized in N-methyl pyrrolidone from biphenyltetracarboxylic dianhydride and 4,4＇-oxydiphenylene diamine, and then converted to the polyimide in films by thermal imidization at 400 degrees C. The polyimide exhibits an exceptionally good self-adhesion (814-1187 J/m(2)) and also good adhesions (>687 J/m(2)) to inorganic substrates such as silicon wafer and glass ceramic. An oxygen plasma treatment enhances the self-adhesion highly, whereas a silane primer treatment improves the adhesions to the substrates. In addition, the morphological structure and some other properties were investigated.