A series of laboratory tests and computer simulations of adhesive curing enhanced by radio-frequency heating indicated that not all adhesive systems can be effectively used for RF-based curing because of the danger of thermal runaway. Our investigation of the process mechanism also resulted in several other findings that could lead to further improvement of the processing cycle. Both experimental and theoretical results indicated a high sensitivity of the adhesive exothermal reaction kinetics to the thickness of the bond line, which varies with changes of the thickness of the processed sheet molding compound (SMC) components. Thus, regardless of the type of adhesive system employed, tighter dimensional tolerance would ensure better quality of the bond. Finally, we proved that the initial surface temperature of the SMC members substantially affects the process effectiveness and joint quality, and should be strictly monitored.