Copper sulfide (CuS) powder precipitated from two different chemical baths (citrate and triethanolamine baths) was dispersed in a poly(acrylic acid) aqueous solution and the resulting mixtures were screen-printed over glass slides. Compared to the coatings of the same composite materials obtained by casting, the screen-printed coatings show better homogeneity and an improved thermal stability (up to 300 degrees C). Sheet resistances of 50 Omega/square were typical in 20 mu m thick coatings and these values remained stable even after baking in nitrogen or vacuum at 20-300 degrees C. The X-ray diffraction pattern indicates degradation of CuS to Cu1.8S and Cu1.96S, particularly in air-baked samples at 250-300 degrees C. The XRD, TGA and R-square results show CuS(Cit)-PAA samples as superior conductive coatings.