The kinetics of the curing of the brominated epoxy resin/dicyandiamide (DICY) system in the presence of copper oxides was investigated by isothermal differential scanning calorimetry (DSC). In essence, the heat of curing of brominated epoxy resins increases with increasing temperature as a result of the decrease in unreacted residual DICY at high temperature. The addition of small amounts of CuO and Cu2O to the resins results in an increase in unreacted DICY left in the cured resins. Preferential adsorption of DICY on copper oxides is responsible for this difference. However, the amounts of unreacted DICY can be decreased by adding 2-methylimidazole (2-MI) to the resins. From large differences in enthalpy values and reaction orders but relatively unchanged T(g) values among various specimens obtained during curing of brominated epoxy/DICY/2-MI, it can be established that the system during curing could involve complex competing reaction mechanisms which cannot be described with a simple mathematical expression.