The effects of solvents on the curing behaviors of an epoxy (diglycidyl ether of bisphenol-a) and dicyandiamide/2-methyl imidazole system have been studied with differential thermal calorimetry (DSC) and Fourier transform infrared spectroscopy (FTIR). From DSC analyses of the specimens prepared with unsealed aluminum pans, the reaction exotherm, the time to maximal curing rate, the glass-transition temperature, the rate constant, and the reaction order of the epoxy system decrease in the presence of solvents were obtained. The changes were in the order of toluene>tetra-hydrofuran>acetone and which are consistent with the order of their boiling points. The heat absorbed during the solvent evaporation consumed the curing exotherm and resulted in a change in temperature dependent curing mechanisms. The results from FTIR spectra confirmed that the composition of the cured resin was influenced by the curing temperature and the type of the solvent used.