Thin Solid Films, Vol.236, No.1-2, 325-329, 1993
Manufacturing Aspects of Low-Pressure Chemical-Vapor-Deposited Tin Barrier Layers
The growth in the number of applications of TiN in recent years has put increasing demands on the performance of TiN films. The use of TIN films in applications such as contact barriers, glue layers and sidewall spacers is discussed, integration issues are considered, and future requirements of devices incorporating TiN films are suggested.