Silicon oxide and carbide ultrathin films (less than 50 Angstrom thick) were grown at rates of up to 1 Angstrom s(-1) using a previously developed technique. To form silicon oxide, a mixture of silane or tetramethylsilane and water was condensed onto a metal surface, which was then exposed to either broad-band or monochromatized synchrotron radiation. Characterization by soft X-ray photoelectron spectroscopy and near-edge X-ray absorption fine structure showed that clean, near-stoichiometric films of self-limited thickness were grown. The results also suggested that the reactions leading to film growth were predominantly excited by electrons produced by photon absorption in the substrate.