Many measurement and control applications requiring MEMS technology are in the presence of harsh environments, e.g. high temperatures, intense shock/vibrations, erosive flows, and corrosive media. Unlike Si, SIC as a semiconductor material is exceptionally well suited for addressing such application opportunities. However, many challenges must be met in order to develop a mature SiC MEMS fabrication technology. These challenges are primarily technical in nature and relate to material and processing aspects. This paper presents a review of recent advancements in areas that are critical to the establishment of a SiC MEMS technology.