화학공학소재연구정보센터
Advances in Polymer Technology, Vol.20, No.1, 14-21, 2001
Numerical simulation of thermally induced stress and warpage in injection-molded thermoplastics
Thermally induced stress and the relevant warpage caused by inappropriate mold design and processing conditions are problems that confound the overall success of injection molding. The numerical simulation with the finite element method is studied in this article to predict thermally induced warpage and residual stress of injection-molded parts generated during the cooling stage of the injection-molding cycle. A thermorheologically simple two-dimensional thermoviscoelastic material model is used in the numerical computing. The initial temperature field of the analysis corresponds to the end of the filling stage. The fully time-dependent algorithm is based on the calculation of the elastic response at every time step. Numerical results are discussed with respect to temperature and pressure, and compared with the experiment results in Santhanam and Wang.(14) (C) 2001 John Wiley & Sons, Inc.