In this study we demonstrate the feasibility of micropipe reduction in SiC commercial wafers by using liquid phase epitaxial (LPE) growth. We have studied the stability of the micropipe healing by performing hot KOH etching and growing thick (40-50 mum) layer with sublimation epitaxy at temperature higher than that used for the LPE growth. Experimental evidences have been collected by means of different techniques and a phenomenological model for micropipe healing is proposed.