Adhesional shear strength and chemical composition at the Si/EVA interface of samples extracted from a PV module manufactured by a major manufacturer using slow-cure EVA and deployed in the hot and humid climate at Cocoa, FL were studied. Precipitation of sodium from glass superstrate and ambient, and phosphorous from dopant glass reduced adhesional strength at Si/EVA interface to similar to 35% of that in new modules. Presence of tin at this interface has also been attributed to solder-bond corrosion by moisture and impurities Na and P. It is interesting to point out that in this case, corrosion has occurred prior to delamination. (C) 2001 Elsevier Science B.V. All rights reserved.