경질 PU 발포공정에 있어서 EG의 첨가가 발포체의 구조와 물성에 미치는 영향

백운선; 이기윤; Woon Seon Baek; Kee Yoon Lee

Polymer(Korea), Vol.25, No.4, 528-535, July, 2001

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경질 PU 발포공정에 있어서 EG의 첨가가 발포체의 구조와 물성에 미치는 영향

Effects of Introducing EG on Foamed Cellular Structure and Properties in the Foaming Process of Rigid PU

백운선, 이기윤^†

충남대학교 공과대학 고분자공학과

Woon Seon Baek, and Kee Yoon Lee^†

Department of Polymer Science and Engineering, Chungnam National University, Taejeon 305-764, Korea

E-mail:

초록

본 연구에서는 polyol, MDI, 실리콘 유화제, 물을 기본 폴리우레탄 조성으로 설정하였으며, 경질 폴리우레탄 폼에 있어서 sitff-chain 요소인 에틸렌 글리콜의 첨가에 의하여 가교밀도가 증가하며, 이에 따른 셀의 크기, 발포 배율, cream time, gel time, take free time의 변화, 최종 자유 발포체 높이, 반응 온도, 단열도 변화를 관찰하였다. 발포제는 시클로펜탄을 사용하여 경질 물리우레탄을 발포하였으며, 상온, 상압에서 hand sixing 으로 5000 rpm, 4sec의 범위 안에서 혼합시킨 뒤에, 에틸렌 글리콜의 양을 변화시켜 200 X 200 X 200 mm 내의 나무 금형 안에서 발포 실험하였다. 이소시아네이트 인덱스를 고정시켰을 경우 에틸렌글리콜의 양이 증가함에 따라 셀의 크기는 약 5.1%와 열전도는 약 14%가 감소하였다.

Polyurethane specimens were mainly composed of polyol, MDI, silicone surfactant, and water. The effects of ethylene glycol on the cell size, forming magnification, cream time, gel time, take free time, final free rising height, and reactive temperature were investigated. The cyclopentane was used for PU foam as a physical blowing agent. The components were hand-mixed at about 5000 rpm within 4 seconds at room temperature. The mixtures with various ethylene glycol contents were foamed in the wood mold. When the index of isocyanate was fixed, as the amount of ethylene glycol increased, cell size and thermal conductivity were decreased by about 5.1% and 14%, respectively.

Keywords:polyurethane;foam;ethylene glycol;thermal conductivity;density

[References]

Kim C, Youn JR, Lee J, Korean J. Rheol., 9(4), 190 (1997)
Becker WE, "Reaction Injection Molding", p. 2, Van Nostrand Reinhold Company, New York (1979)
Volkert O, J. Cell. Plast., 31, 210 (1995)
Parks KL, Beckman EJ, Polym. Eng. Sci., 36(19), 2404 (1996)
Biesmans G, Colman L, Vandensande R, J. Colloid Interface Sci., 199(2), 140 (1998)
Schilling SL, J. Cell. Plast., 36, 190 (2000)
Lee Y, Kim W, Kim W, Polym.(Korea), 24(6), 744 (2000)
Wang TL, Hsieh TH, Polym. Degrad. Stabil., 55, 95 (1997)
Jackson GV, Leach AG, J. Phys. D. Appl. Phys., 26, 740 (1993)
Szycher, "Szycher's Handbook of Polyurethanes", p. 2, CRC (1999)
Oertal G, "Polyurethane Handbook: Chemistry-Raw material-Processing-Application-Properties", p. 254, Hanser Publishers, New York (1985)
Hur MK, Kwak JM, Hur T, Polym.(Korea), 20(3), 392 (1996)
Wirpsza Z, "Polyurethanes-Chemistry, Technology and Applications", p. 30, Ellis Horwood, New York (1991)
Woods G, "The ICI Polyurethane Book", p. 47, John Wiley & Sons, New York (1990)

[Referenced By]

[1] Kim C, Youn JR, Lee J, Korean J. Rheol., 9(4), 190 (1997)

[2] Becker WE, "Reaction Injection Molding", p. 2, Van Nostrand Reinhold Company, New York (1979)

[3] Volkert O, J. Cell. Plast., 31, 210 (1995)

[4] Parks KL, Beckman EJ, Polym. Eng. Sci., 36(19), 2404 (1996)

[5] Biesmans G, Colman L, Vandensande R, J. Colloid Interface Sci., 199(2), 140 (1998)

[6] Schilling SL, J. Cell. Plast., 36, 190 (2000)

[7] Lee Y, Kim W, Kim W, Polym.(Korea), 24(6), 744 (2000)

[8] Wang TL, Hsieh TH, Polym. Degrad. Stabil., 55, 95 (1997)

[9] Jackson GV, Leach AG, J. Phys. D. Appl. Phys., 26, 740 (1993)

[10] Szycher, "Szycher's Handbook of Polyurethanes", p. 2, CRC (1999)

[11] Oertal G, "Polyurethane Handbook: Chemistry-Raw material-Processing-Application-Properties", p. 254, Hanser Publishers, New York (1985)

[12] Hur MK, Kwak JM, Hur T, Polym.(Korea), 20(3), 392 (1996)

[13] Wirpsza Z, "Polyurethanes-Chemistry, Technology and Applications", p. 30, Ellis Horwood, New York (1991)

[14] Woods G, "The ICI Polyurethane Book", p. 47, John Wiley & Sons, New York (1990)