화학공학소재연구정보센터
Journal of the Electrochemical Society, Vol.147, No.6, 2181-2189, 2000
Laser-assisted electroless Ni-P deposition at selected areas on Al (-Mg, Si, Cu) alloys
Local deposition of Ni-P alloys on highly pure aluminum, commercially pure aluminum, Al-Cu-Mn, Al-Mg, and Al-Si-Mg alloys was attempted by anodizing, laser irradiation, and electroless plating. Specimens were first anodized at 15 V in 16% H2SO4, and then irradiated with a pulsed Nd-yttrium-aluminum-garnet laser in a Ni2+/H2PO2- solution. Nickel-phosphorous electroless plating was finally carried out in a Ni2+/H2PO2- solution with 0.6 ppm of Pb2+ ions. The effect of alloying elements on the Ni-P deposition during electroless plating was investigated. Anodic oxide films on all the specimens were sufficiently stable in Ni-P electroless plating solution and able to ensure local deposition of Ni-P only at the laser-irradiated areas. The deposition rate of Ni-P on all the aluminum alloy specimens was higher than that on highly pure aluminum. The effect of the alloying elements on the Ni-P deposition in electroless plating is discussed in terms of the catalytic function in Ni-P electroless deposition and the inhibition of the oxide film Formation during laser irradiation.