화학공학소재연구정보센터
Journal of Materials Science, Vol.36, No.11, 2673-2678, 2001
Heat-resistant joints of Si3N4 ceramics with intermetallic compounds formed in situ
The possibility of the improvement on the heat resistance of Si3N4 ceramic joints with intermetallic compounds formed in situ was investigated. The Si3N4 ceramics were joined with Ti/Ni/Ti multi-interlayers between 1000 and 1150 degreesC. The effects of various parameters, which include the thickness of Ti and Ni foils, the pressure imposed during bonding, the bonding temperature and the holding time, on the microstructures and the strength (both at room temperature and at high temperature) of the joints were studied. The results indicated that the sound joints with higher strength both at room temperature and at elevated temperature could be acquired with intermetallic compounds formed in situ under appropriate bonding parameters. The shear strength at 800 degreesC could sustain about 88 MPa.