The curing behavior of the epoxy resin N,N,N',N'-tetraglycidyldiaminodiphenyl methane (TGDDM) with triglycidyl p-aminophenol as a reactive diluent was investigated using 2,2'-dichloro-4,4'-diaminodiphenylmethane (DCDDM) as the curing agent. The effect of the curing agent on the kinetics of curing, shelf-life, and thermal stability in comparison with a TGDDM-diaminodiphenylsulfone (DDS) system was studied. The results showed a lesser activation energy at the lower level of conversion with a broader cure exotherm for the epoxy-DCDDM system in comparison with the epoxy-DDS system, although the overall activation energy for the two systems was comparable. TGA studies showed more stability in the epoxy-DCDDM system than in the epoxy-DDS system.