Thermal stability of thin Ge/C films, deposited using organometallic vapour deposition from tetraethylgermanium in radio frequency glow discharge, has been studied by means of thermogravimetry. Measurements were taken within a temperature range of 25-800 degrees C. The first thermogravimetric run revealed a weight loss of these materials amounting to approximately 25%, while in the second run this loss did not exceed 1.5%. This stabilization of the films under thermal annealing conditions, together with the advantageous temperature coefficients of their DC conductivity make them potential candidates for thermistor materials. Two different routes of fabrication of thermally stable films for thermistor application have been proposed.