It has been recently demonstrated that there is an important correlation between the thermal contact resistance and the nature of the interfacial domain. This can have an important effect on the performance of thermophysical and mechanical properties of solids in submicronic scales. Heat transfer and mechanical properties of gold films deposited on the Al2O3 ceramic substrates are directly measured by a photo-thermal method and scratch adhesion tests, respectively. In the present work, we study the effect of thickness and thermal treatment on these properties. Both the morphology change and the formation of a complex in the interface seem to be responsible for the thermal contact resistance and adhesion enhancement in thermal treated samples.