A new sputter method for high rate deposition of TiO2 was developed for application to the common planar magnetron sputter system. In this method, DC power is applied to plasma sprayed TiO2-x targets using a sputter gas of a few percent of O-2 diluted with Ar and then TiO2 films are deposited with a high deposition rate (eight times higher than that by the conventional method) and a good uniformity of thickness and refractive-index distribution.