Ceramic-metal joining techniques have traditionally been concerned with topics such as interfacial reactions between glass/ceramic, wetting, graded seals, active metal braze reactions, residual tensile stresses, atom migration, temperature and atmospheric effects, etc. These reactions are complex and require substantial trial and error and analytical techniques to develop the proper interfaces for reliable bonding. In contrast, we have developed a simple shrink-hi ceramic/metal join for use as a new ceramic wafer retaining ring in chemical mechanical planarization. The join relies on thermal coefficient of expansion mismatch between the metal and the ceramic. The join requires no other materials such as braze or metallization and can be performed with one heating cycle in a low temperature oven. In addition, the join is reversible with reheating. This article details design considerations for developing this bond. In addition, stress analysis results using finite element analysis are presented and discussed.