Embedded capacitor technology can increase silicon packing efficiency, improve electrical performance, and reduce assembly cost compared with traditional discrete capacitor technology. Developing a suitable material that satisfies electrical, reliability, and processing requirements is one of the major challenges of incorporating capacitors into a printed wiring board (PWB). Polymer-ceramic composites have been of great interest as embedded capacitor material because they combine the processability of polymers with the high dielectric constant of ceramics. A novel nanostructure polymer-ceramic composite with a very high dielectric constant (epsilon (r) similar to 110, a new record for the highest reported epsilon (r) value of a nanocomposite) was developed in this work. A high dielectric constant is obtained by increasing the dielectric constant of the epoxy matrix (epsilon (r) > 6) and using the combination of lead magnesium niobate-lead titanate (PMN-PT)/BaTiO3 as the ceramic filler. This nanocomposite has a low curing temperature (<200C); thus, it is multichip-module laminate (MCM-L) process-compatible. An embedded capacitor prototype with a capacitance density of 50 nF/cm(2) was manufactured using this nanocomposite and spin-coating technology. The effect of the composite microstructure on the effective dielectric constant was studied. This novel nanocomposite can be used for integral capacitors in PWBs.