Aluminum specimens covered with anodic oxide films were scratched with an atomic force microscope (AFM) probe in air, pure water, CuSO4 solutions, Cu-electroless plating solution, and diluted NaOH solutions to examine the effect of the probe load, scratch number, and processing environment on the rate of groove development. The rest potential of the aluminum was monitored during scratching in the solutions, and in situ AFM observations were carried out after the scratching. Probe wear was also examined in pure water and NaOH solution. The rate of groove development was in the order NaOH > CuSO4 > air > purewater > Cu-electroless solution, and decreased with decreasing probe load and increasing scratch number. The rest potential remained steady in the solutions during scratching with loads below 12.5 muN, while it dropped rapidly above 25 muN. Copper was deposited in and around grooves during scratching in Cu-SO4 and Cu-electroless plating solution at the high loads, and after the scratching copper deposits grew only during immersion in Cu-electroless plating solution. Probe-tip wear was greater in NaOH solution than in distilled water.