Waste streams generated by electroless copper plating in the printed circuit boards manufacturing industry often contain copper complexed by strong chelating agents such as EDTA. The consequence of metal complexation by chelating agents is that alternative treatment to chemical precipitation is often necessary to achieve the low metal concentrations required by increasingly stringent environmental regulations. This paper examines the feasibility of using activated carbon to remove EDTA-chelated copper(II) species as well as free copper(II) ions from aqueous solution. The adsorption characteristics of copper(II) and EDTA-chelated copper(II) on two granular activated carbons prepared from coal and coconut shell were evaluated. Adsorption equilibrium data of copper(II) on the two carbons corresponded well to the Langmuir model. The coconut shell-based carbon exhibited a greater adsorption capacity for copper(II) than the coal-based carbon under similar experimental conditions. Solution pH had a considerable influence an copper(II) adsorption by the two carbons. Low adsorption levels of copper(II) at pH 3 and high adsorption levels in the pH range of 4-6 were observed. However, a reverse adsorption trend was observed when the chelating agent EDTA was added to the copper(II) solution. Adsorption of EDTA-chelated copper(II) by the two carbons was higher at pH 3 than at pH 6. The contrasting adsorption behaviour of copper(II) ions and EDTA-chelated copper(II) species can be readily explained in terms of electrostatic interaction in that solution pH influences the surface charge of the carbons as well as the charge property of copper(II) ions and EDTA-chelated copper(II) species.