With fast advancement of fine machineries and semiconductor industries in recent decades, the ultra-cleaning of organic chemicals, submicron particles from contraminated unit equipments and products such as silicon wafers becomes one of the most important steps for further advancement of such industries. To date, two kinds of ultra cleaning techniques are used; one is the wet-cleaning and the other is the dry cleaning. In case of wet cleaning, removal of organic contaminants and submicron particles is made by DIW with additives such as H2O2, H2SO4, HCl, NH4OH and HF, etc. While the wet cleaning method is most widely adopted for various occasions, it is inevitable to discharge significant amount of toxic waste waters in environment. Dry cleaning is an alternative method to mitigate environmental pollution of the wet cleaning with maintaining comparable degree of cleaning to the wet cleaning. Although there are various concept of dry cleaning have been devised, the dry cleaning with environmentally-benign solvent such as carbon dioxide proven to show high degree of cleaning from the contaminated porous surface as well as from the bare surface. Thus, special global attention has been placing on this technique since it has important advantages of simple process schemes and no environmentally concern, etc. Thus, this article critically reviews the state-of-the-art of the supercritical fluid drying with emphasis on the thermo-physical characteristics of the supercritical solvent, environmental gains compared to other dry cleaning methods, and the generic aspects of the basic design and processing engineering.