Previous Article Next Article Table of Contents Chemie Ingenieur Technik, Vol.74, No.8, 1151-1155, 2002 DOI10.1002/1522-2640(20020815)74:8<1151::AID-CITE1151>3.0.CO;2-X Export Citation Characterization of suspensions from chemical-mechanical polishing in the semiconductor industry Kuntzsch T, Hollatz M, Stintz M, Ripperger S Please enable JavaScript to view the comments powered by Disqus.