간략화된 MCVD 반응기에서의 초미립 SiO<SUB>2</SUB> 입자 증착특성

현봉수; 김교선

HWAHAK KONGHAK, Vol.34, No.2, 243-248, April, 1996

Export Citation

간략화된 MCVD 반응기에서의 초미립 SiO₂ 입자 증착특성

Deposition Characteristics of Ultrafine SiO₂ Particles in Simplified MCVD Reactor

현봉수, 김교선

초록

간략화된 MCVD 반응기에서 가열로 설정온도, 전체기체유량 및 초기 SiCl₄ 농도 등의 공정조건을 변화시키며 SiO₂ 입자의 증착특성에 대하여 이론적/실험적으로 연구하였다. 수치모사에서는 반응기 내의 전달현상식과 에어로졸 동력학식을 고려하였으며 수치모사에 의한 증착구간에서의 증착효율은 실험결과와 비교적 잘 일치하였다. 본 연구의 공정조건 범위에서는 가열로 설정온도가 높을수록, 초기 SiCl₄ 농도가 낮을수록 SiO₂입자의 증착효ㅇ은 높게 나타났으며, 전체기체유량이 증가할수록 SiCl₄의 전환율과 증착효율은 감소하였다.

The deposition characteristics of SiO₂ particles were investigated in simplified MCVD reactor theoretically and experimentally, changing the process conditions of furnace setting temperature, total gas flow rate and inlet SiCl₄ concentration. The transport phenomena equations and aerosol dynamic equations inside reactor were considered in numerical simulation. The computed deposition efficiencies in deposition zone were in good agreement with the experimental results. For the process conditions in this study, it is found that the deposition efficiency of SiO₂ particles increases as the furnace setting temperature increases, also as the inlet SiCl₄ concentration decreases. As the total gas flow rate increases, the SiCl₄ conversion and deposition efficiency decrease.

Keywords:Ultrafine SiO₂ Particles;Optical Fiber Preform;MCVD;Deposition Efficiencies;SiCl₄ Conversion

[References]

Kim KS, Chem. Ind. Technol., 11(5), 357 (1993)
MacChesney JB, O'Connor PB, Presby HM, Proc. IEEE, 62, 1278 (1974)
Morrow AJ, Schultz PC, "Outside Vapor Deposition," Corquide, Technical Report of Corning, March (1984)
Kim KS, Pratsinis SE, AIChE J., 34, 912 (1988)
Lee HH, "Fundamentals of Microelectronics Processing," MacGraw-Hill, New York (1990)
Walker KL, Geyling FT, Nagel SR, J. Am. Ceram. Soc., 63, 552 (1980)
Nagel SR, MacChesney JB, Walker KR, IEEE J. Quantum Electron., QE18, 459 (1982)
Powers DR, J. Am. Ceram. Soc., 61, 295 (1978)
French WG, Pace LJ, Foertmeyer VA, J. Phys. Chem., 82, 2191 (1978)
Weinberg MC, J. Colloid Interface Sci., 87, 579 (1982)
Pratsinis SE, J. Colloid Interface Sci., 124, 416 (1988)
Pratsinis SE, Kim KS, J. Aerosol Sci., 20, 101 (1988)
Hyun BS, Kim KS, HWAHAK KONGHAK, 33(2), 183 (1995)
Friedlander SK, "Smoke, Dust and Haze," Wiley, New York (1977)
Seinfeld JH, "Atmospheric Chemistry and Physics of Air Pollution," Wiley, New York (1986)
Brock JR, "Simulation of Aerosol Dynamics in Theory of Disperse Multiflow (Mayer, R.E. ed.)," Academic Press, New York (1983)
Kays WM, Perkins HC, "Handbook of Heat Transfer (edited by Rohsenow, W.M., Hartnett, J.P. and Ganic, E.N.)," 2nd ed., MacGraw-Hill, New York, Ch. 7 (1985)

[Referenced By]

[1] Kim KS, Chem. Ind. Technol., 11(5), 357 (1993)

[2] MacChesney JB, O'Connor PB, Presby HM, Proc. IEEE, 62, 1278 (1974)

[3] Morrow AJ, Schultz PC, "Outside Vapor Deposition," Corquide, Technical Report of Corning, March (1984)

[4] Kim KS, Pratsinis SE, AIChE J., 34, 912 (1988)

[5] Lee HH, "Fundamentals of Microelectronics Processing," MacGraw-Hill, New York (1990)

[6] Walker KL, Geyling FT, Nagel SR, J. Am. Ceram. Soc., 63, 552 (1980)

[7] Nagel SR, MacChesney JB, Walker KR, IEEE J. Quantum Electron., QE18, 459 (1982)

[8] Powers DR, J. Am. Ceram. Soc., 61, 295 (1978)

[9] French WG, Pace LJ, Foertmeyer VA, J. Phys. Chem., 82, 2191 (1978)

[10] Weinberg MC, J. Colloid Interface Sci., 87, 579 (1982)

[11] Pratsinis SE, J. Colloid Interface Sci., 124, 416 (1988)

[12] Pratsinis SE, Kim KS, J. Aerosol Sci., 20, 101 (1988)

[13] Hyun BS, Kim KS, HWAHAK KONGHAK, 33(2), 183 (1995)

[14] Friedlander SK, "Smoke, Dust and Haze," Wiley, New York (1977)

[15] Seinfeld JH, "Atmospheric Chemistry and Physics of Air Pollution," Wiley, New York (1986)

[16] Brock JR, "Simulation of Aerosol Dynamics in Theory of Disperse Multiflow (Mayer, R.E. ed.)," Academic Press, New York (1983)

[17] Kays WM, Perkins HC, "Handbook of Heat Transfer (edited by Rohsenow, W.M., Hartnett, J.P. and Ganic, E.N.)," 2nd ed., MacGraw-Hill, New York, Ch. 7 (1985)