The objective of this research is to understand the influence of the thermochemical and thermomechanical material response of low temperature cured vinyl ester resin (Dow Derakane 411-C-50) on the development of residual stress and warpage during processing. The primary experimental technique is the bimaterial specimen experiment, in which the warpage of a bimaterial beam is used as a measure of residual stress. The bimaterial specimen experiment was developed to isolate the chemical and thermal contributions to curvature. Existing material models for shrinkage, modulus, and glass transition temperature as a function of cure were evaluated. These material models were used as input into the bimaterial equation for curvature prediction. The predicted curvatures were used along with the experimental curvatures to evaluate the material models and their ability to accurately describe the material response of the vinyl ester resin. Results showed that the model captured the overall experimental trend in curvature buildup during processing but overestimated the curvature from chemical effects during isothermal cure. Improved correlation was achieved by incorporating a time shift in the model to account for viscoelastic stress relaxation of the resin.