We carried out a feasibility study of the use of black rice husk ash (RHA) as a filler in epoxy resin for embedding material in electrical and electronic applications. We made a comparison by mixing RHA and two commercial fillers, fused and crystalline silica, with epoxy resin at weight fractions ranging from 20-60%. RHA-filled epoxy resin had higher mixing viscosity, coefficient of thermal expansion, and water absorption percentage than commercial-silica-filled epoxy composite. However, the impact strength of all composites was comparable, but the tensile strength and elongation at break of silica-filled epoxy were slightly superior.