Journal of Applied Polymer Science, Vol.86, No.14, 3520-3526, 2002
Heterocyclic-based epoxy-terminated structural adhesive. II. Curing, adhesive strength, and thermal stability
We studied the curing behavior of heterocyclic-based epoxy-terminated resins using diaminodiphenyl ether, diaminodiphenyl sulfone, benzophenone tetracarboxylicdianhydride, and the commercial hardener of Ciba-Geigy's two-pack Araldite as curing agents. The adhesive strength of the adhesives was measured by various ASTM methods such as lap-shear, peel, and cohesive tests on metal-metal, wood-wood, and wood-metal interfaces. All of these results were compared with those of an epoxy resin prepared from bisphenol-A and epichlorohydrin resin with an epoxy equivalent value of 0.519. The thermal stability of both the virgin resin and its cured form was also studied by thermogravimetric analysis.