화학공학소재연구정보센터
Korean Journal of Chemical Engineering, Vol.20, No.2, 239-246, March, 2003
Oxidation of Volatile Organic Compounds by Using a Microwave-Induced Plasma Process
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A microwave plasma system using a 2.45 GHz magnetron was applied to the decomposition of volatile organic compounds such as toluene and trichloroethylene. Designed for producing plasma at atmospheric pressure, this microwave plasma system consists of a magnetron detached from a household microwave oven, a directional coupler, a three-stub tuner, a tapered waveguide, and plasma flame section where a quartz tube with a nozzle is located. In this system, the organic compounds can be decomposed by thermal incineration as well as by reactions with various active species formed during plasma discharge. The effect of feed gas flow rate on the decomposition was significant due to the decrease in the gas temperature, but the initial concentration in the range of 210-2,100 ppm did not largely affect the decomposition efficiency. The principal byproduct was nitrogen oxides because this system was operated at high temperature. To improve the decomposition of the organic compounds, argon was used as a plasma-assisting gas, together with the air-like feed gas mixture. Large enhancement in the decomposition efficiency was achieved by the use of argon.
  1. Atkinson R, Baulch DL, Cox RA, Hampson RF, Kerr JA, Troe J, J. Phys. Chem. Ref. Data, 21(6), 1125 (1992)
  2. Bae YS, Choi EM, Chung WS, Lee YH, Namkung W, Cho MH, "Development of 2.45 GHz Waveguide-Based Air Torch System," Joint Int. Plasma Symp. 6th APCPST, 15th SPSM, OS2002 and 11th KAPRA, Lotte Hotel, Jeju, South Korea, July 1-4 (2002)
  3. Baeva M, Gier H, Pott A, Uhlenbusch J, Plasma Chem. Plasma Process., 21, 225 (2001) 
  4. Bailin LJ, Sibert ME, Jonas LA, Bell AT, Environ. Sci. Technol., 9, 254 (1975) 
  5. Cho WI, Baek YS, Pang HS, Kim YC, Moon SK, J. Korean Ind. Eng. Chem., 9(1), 94 (1998)
  6. Cho W, Baek Y, Pang H, Kim YC, Korean J. Chem. Eng., 15(5), 500 (1998)
  7. Cho SJ, Ryoo MW, Soun KS, Lee JH, Kang SK, Korean J. Chem. Eng., 16(4), 478 (1999)
  8. Choi YS, Song YH, Kim SJ, Kim BU, HWAHAK KONGHAK, 38(3), 423 (2000)
  9. Cooper CD, Alley FC, "Air Pollution Control: A Design Approach," Waveland Press, Inc. (1994)
  10. Futamura S, Zhang A, Yamamoto T, IEEE Trans. Ind. Appl., 35(4), 760 (1999) 
  11. Jeong HK, Kim SC, Han C, Lee H, Song HK, Na BK, Korean J. Chem. Eng., 18(2), 196 (2001)
  12. Kim JS, Lee TK, Korean J. Chem. Eng., 18(6), 935 (2001)
  13. Kim SJ, Cho SY, Kim TY, Korean J. Chem. Eng., 19(1), 61 (2002)
  14. Kohno H, Berezin AA, Chang JS, Tamura M, Yamamoto T, Shibuya A, Honda S, IEEE Trans. Ind. Appl., 34(5), 953 (1998) 
  15. Krasnoperov LN, Krishtopa LG, Bozzelli JW, J. Adv. Oxid. Technol., 2(1), 248 (1997)
  16. Kucukarpaci H, Lucas J, J. Phys. D, 12, 2123 (1979) 
  17. Mok YS, Kim JH, Nam IS, Ham SW, Ind. Eng. Chem. Res., 39(10), 3938 (2000) 
  18. Mok YS, Nam CM, Cho MH, Nam I, IEEE Trans. Plasma Sci., 30(1), 408 (2002) 
  19. Moon S, Chae J, J. Korean Soc. Environ. Eng., 23, 243 (2001)
  20. Oda T, Yamashita R, Haga I, Takahashi T, Masuda S, IEEE Trans. Ind. Appl., 32(1), 118 (1996) 
  21. Ogata A, Shintani N, Mizuno A, Kushiyama S, Yamamoto T, IEEE Trans. Ind. Appl., 35(4), 753 (1999) 
  22. Park HK, "Microwave Engineering," 3rd Ed., Hee Jung Dang Press (1991)
  23. Rosocha LA, Anderson GK, Bechtold LA, Coogan JJ, Heck HG, Kang M, McCulla WH, Tennant RA, Wantuck PJ, "Treatment of Hazardous Organic Wastes Using Silent Discharge Plasmas," Non-Thermal Plasma Techniques for Pollution Control: Part B, Springer-Verlag, Berlin, Germany, 281 (1993)
  24. Sieck LW, Buckley TJ, Herron JT, Green DS, Plasma Chem. Plasma Process., 21(3), 441 (2001) 
  25. Snyder HR, Anderson GK, IEEE Trans. Plasma Sci., 26(6), 1695 (1998) 
  26. Song JH, Seo KW, Mok YI, Park KY, Ahn BS, Korean J. Chem. Eng., 19(2), 246 (2002)
  27. Song Y, Shin D, Shin W, Kim K, Choi Y, Choi YS, Lee W, Kim S, J. Korean Soc. Atmospheric Environ., 16(3), 247 (2000)
  28. Uhm HS, "Contamination Control of Emission Discharge," U.S. Patent, 5,380,328 (1998)
  29. vonHagen J, Venot Y, Zhang Y, Wiesbeck W, IEEE Trans. Plasma Sci., 29(4), 604 (2001) 
  30. Wojtowicz MA, Miknis FP, Grimes RW, Smith WW, Serio MA, J. Hazard. Mater., 74, 81 (2000) 
  31. Yan K, Hui H, Cui M, Miao J, Wu X, Bao C, Li R, J. Electrostatics, 44, 17 (1998)