In this paper we report on nucleation and growth of copper onto TaN from sulfate, ethylenediaminetetraacetate, citrate, and fluoroborate solutions. The onset for copper deposition on TaN is shifted negative by 0.65 V to 1 V compared to deposition on Pt, depending on the solution chemistry. For all solutions, deposition occurs by three-dimensional island growth. The island density generally increases strongly with increasing overpotential and is also dependent on solution chemistry. (C) 2003 The Electrochemical Society.