Thin Solid Films, Vol.429, No.1-2, 267-272, 2003
Atomic force microscopy observations of successive damaging mechanisms of thin films on substrates under tensile stress
Atomic force microscopy has been used to characterize the evolution of cracks in a 100 ran thick nickel film on a polyimide substrate under increasing tensile stresses. Successive damaging mechanisms are described and discussed by means of finite element calculations. (C) 2003 Elsevier Science B.V. All rights reserved.