디일렉트로메트리법을 이용한 두꺼운 케블라/에폭시 프리프레그의 경화거동 연구

제갈영순; 진성호; 이원철; 윤남균; Yeong-Soon Geo Gal; Sung-Ho Jin; Won-Chul Lee; Nam-Gyun Yoon

Journal of the Korean Industrial and Engineering Chemistry, Vol.14, No.7, 910-914, November, 2003

Export Citation

디일렉트로메트리법을 이용한 두꺼운 케블라/에폭시 프리프레그의 경화거동 연구

A Study on the Curing Behaviors of Thick Kevlar/Epoxy Prepreg Using Dielectrometry

제갈영순^†, 진성호¹, 이원철², 윤남균³

경일대학교 교양학부, 경북 712-701
¹부산대학교 과학교육학부, 부산 609-735
²경일대학교 섬유패션학과, 경기 449-863
³국방연구소, 대전 305-600

Yeong-Soon Geo Gal^†, Sung-Ho Jin¹, Won-Chul Lee², and Nam-Gyun Yoon³

Polymer Chemistry Laboratory, College of General Education, Kyungil University, Hayang 712-701, Kyungsangbuk-Do, Korea
¹Department of Chemistry Education, School of Education, Pusan University, Busan 609-735, Korea
²Department of Textile and Fashion Technology, kyungil University, Hayang 712-701, Kyungsangbuk-Do, Korea
³Composite Materials Laboratory, Agency for Defence Development, Daejoen 305-600, Korea

E-mail:

초록

경화중 이중극자의 배향 및 이온이동도와 수지의 점도와의 상관 관계를 이용하여 경화거동을 연구할 수 있는 마이크로 디일렉트로메트리법을 이용하여 두꺼운 케블라/에폭시 프리프레그의 경화거동을 연구하였다. 케블라/에폭시 프리프레그 150층을 적층한 프리폼에 센서를 잠입시킨 후 경화주기에 준하여 승온시키면서 이들의 이온점도 거동을 관찰하였는데, 입력주파수에 따라 약간의 차이는 있으나 91 ~ 105 ℃의 범위에서 최소점도값을 보였다. 또한 약 100 ℃에서 최대 전도도값을 보여주었다. 두꺼운 케블라/에폭시 프리프레그의 경화거동은 얇은 케블라/에폭시 프리프레그의 그것과 유사하였다. 특히 본 두꺼운 케블라/에폭시 프리프레그의 경우에는 내부에서 설정한 경화온도보다 훨씬 높은 온도를 보이는 overshoot현상은 보이지 않았다.

The studies on the curing behaviors of thick Kevlar/epoxy prepreg were performed by microdielectrometry method, which used the correlation of the orientation of dipole and the ion mobility with the viscosity of resins during cure. The lowest ionic viscosities of 150 plies Kevlar/Epoxy prepregs according to the curing cycle were observed in the range of 91 ~ 105 ℃, depending on the input frequencies. The maximum conductivity was also observed at about 100 ℃. The curing behaviors of thick Kevlar/epoxy prepreg was found to be similar with that of the same thin prepreg. The overshoot phenomenon was not observed in the present thick Kevlar/epoxy prepreg.

Keywords:prepreg;kevlar/epoxy;composites;dielectrometry;ionic viscosity

[References]

Lubin G, Handbook of Composites, Van Nostrand Reinhold, New York (1982)
May CA, Epoxy resins: Chemistry and Technology, Marcel Dekker, Inc., New York (1988)
Gal YS, Jung B, Polym. Sci. Technol., 3(4), 302 (1992)
Fitzer E, Carbon Fibres and Their Composites, Springer-Verlag, Berlin (1985)
Kaszyk J, The Epoxy Resin Formulators Training Manual, The Society of the Plastics Industry, Inc., New York (1984)
Gal YS, Kang HC, Park BY, Kim HG, Chung SK, Hwang TK, Jung B, J. Macromol. Sci.-Pure Appl. Chem., A32, 981 (1995)
Gal YS, Lee WC, Kwon OH, Yoon NG, Lhim KS, Ahn JK, Park KJ, J. Korean Soc. Comp. Mater., 14(2), 1 (2001)
Gal YS, Jang SH, Sohn TK, Res. Rew. Kyungil Univ., 18, 429 (2002)
Sohn TK, Jang SH, Gal YS, J. Korean Soc. Comp. Mater., 16(4), 22 (2003)
Day DR, Shepard DD, Wall AS, 33th Int. SAMPE Symp., 603 (1988)
Wetton RE, Foster GM, Smith VR, 33th Int. SAMPE Symp., 1285 (1988)
Wai MP, Parker DJ, 33th Int. SAMPE Symp., 725 (1988)
Kranbuehl D, Hoff M, Haverty P, 33th Int. SAMPE Symp., 1276 (1988)
MacKinnon AJ, Jenkins SD, McGrail PT, Pethrick RA, Macromolecules, 25, 3492 (1992)
Casalini R, Corezzi S, Livi A, Levita G, Rolla PA, J. Appl. Polym. Sci., 65(1), 17 (1997)
Daniel VV, Dielectric Relaxation, Academic Press, London and New York, 18 (1967)
Day DR, Dielectric Properties of Polymeric Materials, Micromet Instruments (1988)
U.S. Patent, 4,423,371 (1983)
Day DR, Lewis TJ, Lee HL, Senturia SD, J. Adhes., 18, 73 (1985)
Senturia SD, Sheppard NF, Lee HL, Day DR, J. Adhes., 15, 69 (1982)
Kim H, Char K, Bull. Korean Chem. Soc., 20, 1329 (1999)
Senturia SD, Sheppard NF, Lee HL, Marshall SB, SAMPE J., 19, 22 (1983)
Koike T, J. Appl. Polym. Sci., 44, 679 (1992)
Levita G, Livi A, Rolla PA, Culicchi C, J. Polym. Sci. B: Polym. Phys., 34(16), 2731 (1996)
Bonnet A, Pascault JP, Sautereau H, Rogozinski J, Kranbuehl D, Macromolecules, 33(10), 3833 (2000)
Kortaberria G, Arruti P, Mondragon I, Polym. Int., 50, 957 (2001)
Collins TLD, Davies GR, Ward IM, Polym. Adv. Technol., 12, 544 (2001)
Sun LF, Pang SS, Sterling AM, Negulescu II, Stubblefield MA, J. Appl. Polym. Sci., 83(5), 1074 (2002)
Gal YS, Lee WC, Jeon YJ, Yoon NG, Polym.(Korea), 24(3), 350 (2000)
Gal YS, Jang SH, Res. Rew. Kyungil Univ., 15, 7 (1999)

[1] Lubin G, Handbook of Composites, Van Nostrand Reinhold, New York (1982)

[2] May CA, Epoxy resins: Chemistry and Technology, Marcel Dekker, Inc., New York (1988)

[3] Gal YS, Jung B, Polym. Sci. Technol., 3(4), 302 (1992)

[4] Fitzer E, Carbon Fibres and Their Composites, Springer-Verlag, Berlin (1985)

[5] Kaszyk J, The Epoxy Resin Formulators Training Manual, The Society of the Plastics Industry, Inc., New York (1984)

[6] Gal YS, Kang HC, Park BY, Kim HG, Chung SK, Hwang TK, Jung B, J. Macromol. Sci.-Pure Appl. Chem., A32, 981 (1995)

[7] Gal YS, Lee WC, Kwon OH, Yoon NG, Lhim KS, Ahn JK, Park KJ, J. Korean Soc. Comp. Mater., 14(2), 1 (2001)

[8] Gal YS, Jang SH, Sohn TK, Res. Rew. Kyungil Univ., 18, 429 (2002)

[9] Sohn TK, Jang SH, Gal YS, J. Korean Soc. Comp. Mater., 16(4), 22 (2003)

[10] Day DR, Shepard DD, Wall AS, 33th Int. SAMPE Symp., 603 (1988)

[11] Wetton RE, Foster GM, Smith VR, 33th Int. SAMPE Symp., 1285 (1988)

[12] Wai MP, Parker DJ, 33th Int. SAMPE Symp., 725 (1988)

[13] Kranbuehl D, Hoff M, Haverty P, 33th Int. SAMPE Symp., 1276 (1988)

[14] MacKinnon AJ, Jenkins SD, McGrail PT, Pethrick RA, Macromolecules, 25, 3492 (1992)

[15] Casalini R, Corezzi S, Livi A, Levita G, Rolla PA, J. Appl. Polym. Sci., 65(1), 17 (1997)

[16] Daniel VV, Dielectric Relaxation, Academic Press, London and New York, 18 (1967)

[17] Day DR, Dielectric Properties of Polymeric Materials, Micromet Instruments (1988)

[18] U.S. Patent, 4,423,371 (1983)

[19] Day DR, Lewis TJ, Lee HL, Senturia SD, J. Adhes., 18, 73 (1985)

[20] Senturia SD, Sheppard NF, Lee HL, Day DR, J. Adhes., 15, 69 (1982)

[21] Kim H, Char K, Bull. Korean Chem. Soc., 20, 1329 (1999)

[22] Senturia SD, Sheppard NF, Lee HL, Marshall SB, SAMPE J., 19, 22 (1983)

[23] Koike T, J. Appl. Polym. Sci., 44, 679 (1992)

[24] Levita G, Livi A, Rolla PA, Culicchi C, J. Polym. Sci. B: Polym. Phys., 34(16), 2731 (1996)

[25] Bonnet A, Pascault JP, Sautereau H, Rogozinski J, Kranbuehl D, Macromolecules, 33(10), 3833 (2000)

[26] Kortaberria G, Arruti P, Mondragon I, Polym. Int., 50, 957 (2001)

[27] Collins TLD, Davies GR, Ward IM, Polym. Adv. Technol., 12, 544 (2001)

[28] Sun LF, Pang SS, Sterling AM, Negulescu II, Stubblefield MA, J. Appl. Polym. Sci., 83(5), 1074 (2002)

[29] Gal YS, Lee WC, Jeon YJ, Yoon NG, Polym.(Korea), 24(3), 350 (2000)

[30] Gal YS, Jang SH, Res. Rew. Kyungil Univ., 15, 7 (1999)