A Low-Viscousity, Highly Thermally Conductive Epoxy Molding Compound (EMC)

Jong-Woo Bae; Wonho Kim; Seungchul Hwang; Young-Sun Choe; Sang-Hyun Lee

Macromolecular Research, Vol.12, No.1, 78-84, February, 2004

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A Low-Viscousity, Highly Thermally Conductive Epoxy Molding Compound (EMC)

Jong-Woo Bae, Wonho Kim^{1, †}, Seungchul Hwang¹, Young-Sun Choe¹, and Sang-Hyun Lee²

Korea Institute of Footwear and Leather Technology, Busan 614-100, Korea
¹Department of Chemical Engineering, Pusan National University, Busan 609-735, Korea
²Division of Quantum Metrology, Korea Research Institute of Standards and Science, Daejeon 305-600, Korea

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Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though AlN has some advantages, such as high thermal conductivity and mechanical strength, an AlN-filled EMC could not be applied to commercial products because of its low fluidity and high modulus. To solve this problem, we used 2-μm fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-μm AlN-filled EMC. In addition, the values of the elastic modulus and the dielectric constant were reduced to 90%, although the thermal conductivity of EMC was reduced from 4.3 to 2.5W/m-K, when compared with the 23-μm AlN-filled EMC. Thus, the AlN/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2W/m-K), high fluidity, low elastic modulus, low dielectric constant, and low CTE.

Keywords:low viscosity;high thermal conductivity;AlN;fused silica;EMC.

[References]

McClean WJ, Status 1986, A Report of the Integrated Circuit Industry, Integrated Circuit Engineering Corporation (1986)
Rymaszewski EJ, Tummala RR, Watari T, Microelectronics Rackaging Handbook, R.R. Tummala, E.J. Rymaszewski, and A.G. Klopfenstein, Eds., Chapman & Hall, New York, Part I, pp. 1-128 (1997)
Manzione LT, Plastic Packaging of Microelectronic Devices, VAN NOSTRAND REINHOLD, New York, pp. 99-147 (1990)
Lupinski JH, Moore RS, Polymer Materials for Electronics Packaging and Interconnection, J.H. Lupinski and R.S. Moore, Eds., American Chemical Society, Washtington D.C., pp. 1-24 (1989)
Manzione LT, Plastic Packaging of Microelectronic Devices, VAN NOSTRAND REINHOLD, New York, pp. 60-64 (1990)
Wong CP, Bollampally RS, IEEE Trans. Adv. Packag., 22, 54 (1999)
Kim W, Bae JW, Choi ID, Kim YS, Polym. Eng. Sci., 39(4), 756 (1999)
Mooney M, J. Colloid Sci., 6, 162 (1951)
Bae JW, Kim W, Cho SH, Lee SH, J. Mater. Sci., 35(23), 5907 (2000)
Cumberland DJ, Crawford RJ, Handbook of Powder Technology, Elsevier Science Publishers, Amsterdam, Vol. VI, Chap. 4 (1987)
Kinjo N, Ogata M, Nishi K, Kaneda A, "Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices," in Advances in Polymer Science 88, Springer-Verlag, Berlin, Heidelberg (1989)
Incropera FP, Dewitt DP, Introductin to Heat Transfer, 3rd ed., John Wiley & Sons, New York, pp. 50 (1996)
Kingery WO, Bower HK, Uhlmann DR, Introduction to Ceramics, Comprise, Massachusetts, Chap. 18 (1975)
Manson SS, Thermal Stres and Low Cycle Fatigue, Bobrowsky Thermal Shock Parameter, Robert E. Krieger Publishing Company, Florida, Section 7.1, pp. 383 (1981)

[Referenced By]

[Related Articles]

[1] McClean WJ, Status 1986, A Report of the Integrated Circuit Industry, Integrated Circuit Engineering Corporation (1986)

[2] Rymaszewski EJ, Tummala RR, Watari T, Microelectronics Rackaging Handbook, R.R. Tummala, E.J. Rymaszewski, and A.G. Klopfenstein, Eds., Chapman & Hall, New York, Part I, pp. 1-128 (1997)

[3] Manzione LT, Plastic Packaging of Microelectronic Devices, VAN NOSTRAND REINHOLD, New York, pp. 99-147 (1990)

[4] Lupinski JH, Moore RS, Polymer Materials for Electronics Packaging and Interconnection, J.H. Lupinski and R.S. Moore, Eds., American Chemical Society, Washtington D.C., pp. 1-24 (1989)

[5] Manzione LT, Plastic Packaging of Microelectronic Devices, VAN NOSTRAND REINHOLD, New York, pp. 60-64 (1990)

[6] Wong CP, Bollampally RS, IEEE Trans. Adv. Packag., 22, 54 (1999)

[7] Kim W, Bae JW, Choi ID, Kim YS, Polym. Eng. Sci., 39(4), 756 (1999)

[8] Mooney M, J. Colloid Sci., 6, 162 (1951)

[9] Bae JW, Kim W, Cho SH, Lee SH, J. Mater. Sci., 35(23), 5907 (2000)

[10] Cumberland DJ, Crawford RJ, Handbook of Powder Technology, Elsevier Science Publishers, Amsterdam, Vol. VI, Chap. 4 (1987)

[11] Kinjo N, Ogata M, Nishi K, Kaneda A, "Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices," in Advances in Polymer Science 88, Springer-Verlag, Berlin, Heidelberg (1989)

[12] Incropera FP, Dewitt DP, Introductin to Heat Transfer, 3rd ed., John Wiley & Sons, New York, pp. 50 (1996)

[13] Kingery WO, Bower HK, Uhlmann DR, Introduction to Ceramics, Comprise, Massachusetts, Chap. 18 (1975)

[14] Manson SS, Thermal Stres and Low Cycle Fatigue, Bobrowsky Thermal Shock Parameter, Robert E. Krieger Publishing Company, Florida, Section 7.1, pp. 383 (1981)