Journal of Industrial and Engineering Chemistry, Vol.10, No.4, 683-689, July, 2004
Characteristics of a Nickel Film Electroplated on a Copper Substrate in Supercritical CO2
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In this work, nickel electroplating was performed on a copper substrate using a nonionic surfactant in supercritical carbon dioxide to improve the characteristics of an electroplated nickel film. The electric resistance of an emulsion decreased rapidly from 46 to 25 Ω upon increasing the pressure from 80 to 140 bar and was nearly constant at 25 Ω over 140 bar. The conductivity of the emulsion solution was highest at a nonionic surfactant concentration of 0.2 vol% and the dispersion of nickel nano-particles was higher than at any other concentration. The CO2 concentration was controlled at under 50 vol% to reduce the electrical resistance in the emulsion solution. The roughness (Ra) of the copper substrate before plating was 0.084 μm, but the nickel film plated for 10 min smoothed to 0.036 μm and became even smoother with increasing plating time. The dispersion property of the nickel nano-particles in supercritical CO2 was higher than in conventional solvents and was enhanced upon improving the dispersion characteristics of the emulsion solution.
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