This work was performed to investigate the curing behaviors of Korean Dendropanax lacquer and to determine its sufficient curing conditions. In FTIR and AFM analyses, the peak area of C==C (1644 cm(-1)) and the microadhesion decreased with increasing curing time, attributed to oxidative thermal polymerization (or crosslinking). The magnitude of the microadhesion between the probe and the surface related to the surface tack of the lacquer indicates how well the lacquer was cured and crosslinked. The increased contact angle exhibited increasing lacquer hydrophobicity, due to polymerization, during the curing process. Changes in double bond peak, contact angle, and microadhesion were dependent on the curing temperature. The results obtained by chemical and physical measures showed that Korean Dendropanax lacquer can be effectively (economically) cured at 100degreesC for 150 min and at 110degreesC for 120 min. (C) 2004 Wiley Periodicals, Inc.