Because of strong demand of compacted consumer electronics and rapid improvements in the miniaturization of electronic devices, compact or high density multi-layered PCBs (Printed Circuit Board) production facility with high productivity is being actively sought out. In the cooling process of lamination, it is very important to diminish the temperature deviation within the epoxy resin with respect to the position of press. In this study, we measured the temperature distribution of cooling process for CCL (Copper Clad Laminate) manufacturing. As the result, temperature change in the first plate was bigger than the one in the sixth plate. Much higher efficiency of cooling was observed when copper separator was used compared to the cooling at the natural convection state. In addition, when cooled by the copper plate, the temperature deviation between plates in CCL went up to maximum of 9 degrees.