To produce high quality PCB (Printed Circuit Board), CCL (Copper Clad Laminate) that can result in uniform quality is very important. Research and studying the temperature distribution and stress analysis within CCL may not be sufficient. In this study, the temperature distribution of CCL with a separator construction was measured and it was compared with a simulation result. It was found that the separator thickness influenced temperature distribution within CCL. The application of a separator was the most effective means of enhancing cooling performance and laminated in a copper-steel-copper separator was effective in uniform cooling.