폴리이미드 블록공중합체를 사용한 에폭시 수지의 강인화 연구

이신득; 안병헌; 이광기; 김원호; Sin Duk Lee; Byung Hyun Ahn; Kwang Gi Lee; Won Ho Kim

Journal of the Korean Industrial and Engineering Chemistry, Vol.15, No.6, 646-651, October, 2004

Export Citation

폴리이미드 블록공중합체를 사용한 에폭시 수지의 강인화 연구

Toughening of Epoxy Resin with Block Copolyimide

이신득, 안병헌^†, 이광기¹, 김원호 ¹

부경대학교 재료공학부, 부산 608-739
¹부산대학교 화학공학부, 부산 609-735

Sin Duk Lee, Byung Hyun Ahn^†, Kwang Gi Lee¹, and Won Ho Kim¹

Division of Material Engineering, Pukyong Naional University, Pusan 608-739, Korea
¹Division of Chemical Engineering, Pusan National University, Pusan 609-735, Korea

E-mail:

초록

사슬 말단에 아민기를 갖는 아민말단 폴리이미드(PI)와 carboxyl terminated butadiene-acrylonitrile copolymer (CTBN)을 반응시켜 PI-CTBN-PI 블록공중합체 및 PI-CTBN 블록공중합체를 합성하였다. 이들 공중합체를 강인화제로 사용하여 강인화된 에폭시 수지를 제조하고 강인화된 에폭시 수지의 열적 특성, 강인성 및 내용매성을 측정하였다. 에폭시 수지의 K_IC가 1.36 MPaㆍm^0.5인데 비해 PI-CTBN-PI 블록공중합체가 20 phr 첨가된 에폭시 수지는 K_IC가 3.12 MPaㆍm^0.5로서 향상된 강인성을 보였다. 이는 상분리와 말단 아민기의 우수한 계면 접착력에 의해 강인성이 향상된 것으로 사료된다.

PI-CTBN-PI block copolymer and PI-CTBN block copolymer were obtained thru the reaction of amine terminated polyetherimide (PI) and carboxyl terminated butadiene-acrylonitrile copolymer (CTBN). These block copolymers were used as a toughening agent for diglycidyl ether of bisphenol-A epoxy resin that was cured with nadic methyl anhydride (NMA). Thermal properties, fracture toughness (K_IC) and solvent resistance of toughened epoxy resin were measured. The K_IC of epoxy resin toughened with 20 phr of PI-CTBN-PI block copolymer was 3.12 MPaㆍm^0.5 while that of neat epoxy resin was 1.36 MPaㆍm^0.5. Due to the phase separation and the good interfacial adhesion of terminal amine group, the fracture toughness was considered to have increased.

Keywords:PI-CTBN-PI block copolymer;toughening;epoxy resin;fracture toughness

[References]

Wise CW, Cook WD, Goodwin AA, Polymer, 41, 4625 (2000)
Wang D, Zhang G, Zhang Y, Chen S, Effect of reaction induced phase separation on dielectric properties of epoxy resin modified with rubber, properties and Applications of Dielectric Materials Proceedings of the 6th International Conference, 2, 926 (2000)
Derkowski BJ, Avila JA, Eschmann SE, Morphology and compression after impact strength relationship in rubber toughened composites, Proceedings of the ANTEC '99, 3, 3724 (1999)
Morancho JM, Salla JM, Polymer, 40(10), 2821 (1999)
Auad ML, Frontini PM, Borrajo J, Aranguren MI, Polymer, 42(8), 3723 (2001)
Ochi M, Morishita T, Kokufu S, Harada M, Polymer, 42(24), 9687 (2001)
Jong SR, Lu TL, Macromol. Chem. Phys., 200, 87 (1999)
Mimura K, Ito H, Fujioka H, Polymer, 41(12), 4451 (2000)
Bonnet A, Pascault JP, Sautereau H, Taha M, Camberlin Y, Macromolecules, 32(25), 8517 (1999)
Riccardi CC, Borrajo J, Williams JJ, J. Polym. Sci., 34, 349 (1996)
Yorkgitis EM, Eiss NS, Jr., C. Tran, G. L. Wilkes, and J. E. McGrath, Epoxy Resins and Composite I, ed. K. Dusek, Springer-Verlag, Berlin (1986)
U. S. Patent 5,262,507 (1993)
Lin S, Huang SK, J. Polym. Sci. Poly. Chem. Ed., 34, 869 (1996)
Kim HR, Myoung BY, Song KH, Yuck JI, Yoon TH, Polym.(Korea), 25(2), 246 (2001)

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[Related Articles]

[1] Wise CW, Cook WD, Goodwin AA, Polymer, 41, 4625 (2000)

[2] Wang D, Zhang G, Zhang Y, Chen S, Effect of reaction induced phase separation on dielectric properties of epoxy resin modified with rubber, properties and Applications of Dielectric Materials Proceedings of the 6th International Conference, 2, 926 (2000)

[3] Derkowski BJ, Avila JA, Eschmann SE, Morphology and compression after impact strength relationship in rubber toughened composites, Proceedings of the ANTEC '99, 3, 3724 (1999)

[4] Morancho JM, Salla JM, Polymer, 40(10), 2821 (1999)

[5] Auad ML, Frontini PM, Borrajo J, Aranguren MI, Polymer, 42(8), 3723 (2001)

[6] Ochi M, Morishita T, Kokufu S, Harada M, Polymer, 42(24), 9687 (2001)

[7] Jong SR, Lu TL, Macromol. Chem. Phys., 200, 87 (1999)

[8] Mimura K, Ito H, Fujioka H, Polymer, 41(12), 4451 (2000)

[9] Bonnet A, Pascault JP, Sautereau H, Taha M, Camberlin Y, Macromolecules, 32(25), 8517 (1999)

[10] Riccardi CC, Borrajo J, Williams JJ, J. Polym. Sci., 34, 349 (1996)

[11] Yorkgitis EM, Eiss NS, Jr., C. Tran, G. L. Wilkes, and J. E. McGrath, Epoxy Resins and Composite I, ed. K. Dusek, Springer-Verlag, Berlin (1986)

[12] U. S. Patent 5,262,507 (1993)

[13] Lin S, Huang SK, J. Polym. Sci. Poly. Chem. Ed., 34, 869 (1996)

[14] Kim HR, Myoung BY, Song KH, Yuck JI, Yoon TH, Polym.(Korea), 25(2), 246 (2001)