Thin Solid Films, Vol.453-54, 350-352, 2004
Sub-picosecond excimer laser machining of a thick film circuit material
Thick film conductor layer has been ablated by focussed sub-picosecond excimer laser beam to form narrow (typically 20-mum, wide) isolation gaps for conducting polymer based sensor application. (C) 2003 Elsevier B.V. All rights reserved.