A novel positive-working and aqueous-base-developable photosensitive poly(imide benzoxazole) precursor based on a poly(amic acid hydroxyamide) bearing phenolic hydroxyl groups and carboxylic acid groups, a diazonaphthoquinone (DNQ) photosensitive compound, and a solvent was developed. Poly(amic acid hydroxyamide) was prepared through the polymerization of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, trimellitic anhydride chloride, and 4,4'-oxydibenzoyl chloride. Subsequently, the thermal cyclization of the poly(amic acid hydroxyamide) precursor at 350 degreesC produced the corresponding poly(imide benzoxazole). The inherent viscosity of the precursor polymer was 0.17 dL/g. The cyclized poly(imide benzoxazole) showed a high glass-transition temperature of 372 degreesC and 5% weight loss temperatures of 535 degreesC in nitrogen and 509 degreesC in air. The structures of the precursor polymer and the fully cyclized polymer were characterized with Fourier transform infrared and H-1 NMR. The photosensitive polyimide precursor containing 25 wt% DNQ photoactive compound showed a sensitivity of 256 mj/cm(2) and a contrast of 1.14 in a 3-mum film with a 0.6 wt% tetramethylammonium hydroxide developer. A pattern with a resolution of 5 mum was obtained from this composition. (C) 2004 Wiley Periodicals, Inc.