Journal of Materials Science, Vol.39, No.24, 7161-7168, 2004
A demonstration of melt rate control during VAR of "Cracked" electrodes
A particularly challenging problem associated with vacuum arc remelting occurs when trying to maintain accurate control of electrode melt rate as the melt zone passes through a transverse crack in the electrode. As the melt zone approaches the crack, poor heat conduction across the crack drives the local temperature in the electrode tip above its steady-state value, causing the controller to cut back on melting current in response to an increase in melting efficiency. The difficulty arises when the melt zone passes through the crack and encounters the relatively cold metal on the other side, giving rise to an abrupt drop in melt rate. This extremely dynamic melting situation is very difficult to handle using standard load-cell based melt rate control, resulting in large melt rate excursions. We have designed and tested a new generation melt rate controller that is capable of controlling melt rate through crack events. The controller is designed around an accurate dynamic melting model that uses four process variables: electrode tip thermal boundary layer, electrode gap, electrode mass and melting efficiency. Tests, jointly sponsored by the Specialty Metals Processing Consortium and Sandia National Laboratories, were performed at Carpenter Technology Corporation wherein two 0.43 m diameter Pyrome(R)1718 electrodes were melted into 0.51 m diameter ingots. Each electrode was cut approximately halfway through its diameter with an abrasive saw to simulate an electrode crack. Relatively accurate melt rate control through the cuts was demonstrated despite the observation of severe arc disturbances and loss of electrode gap control. Subsequent to remelting, one ingot was sectioned in the "as cast" condition, whereas the other was forged to 0.20 m diameter billet. Macrostructural characterization showed solidification white spots in regions affected by the cut in the electrode. (C) 2004 Kluwer Academic Publishers.