Linear sweep voltammetry and chronoamperometry methods were used to measure limiting current in an industrial wafer-plating cell. Copper deposition in a dilute solution, under mass-transfer-limited conditions, is used to study the variation of the mass transfer boundary-layer thickness. It is shown that a shear-plate fluid agitation mechanism is capable of generating a thin (i.e. < 10 mu m), spatially uniform and nonperiodic boundary layer across the entire wafer. It is anticipated that thin boundary layer deposition will prove to be beneficial in MEMS, flip-chip bumping, and WL-CSP applications. (c) 2005 The Electrochemical Society.