We have fabricated a local vacuum package enclosing a Si field emitter array on Si substrate. To maintain the low pressure required for electron emission, a titanium evaporation getter was made as a bridge structure with the Si field emitter array in local vacuum package. The local vacuum package technique was adapted to the IC process for on-chip device fabrication. This technique will be very useful for many applications with high performance. (c) 2005 American Vacuum Society.