화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Polymer(Korea), Vol.29, No.6, 581-587, November, 2005
Export Citation
대기압 플라스마에 의한 폴리우레탄 필름의 표면 개질
Surface Modification of Polyurethane Film Using Atmospheric Pressure Plasma
양인영, 명성운, 최호석†, 김인호
  • 충남대학교 공과대학 화학공학과
In-Young Yang, Sung-Woon Myung, Ho-Suk Choi†, and In-Ho Kim
  • Department of Chemical Engineering, Chungnam National University, 220 Gung-dong, Yusong-gu, Daejeon 305-764, Korea
E-mail:
초록
상업용 폴리우레탄(PU) 필름의 표면 개질 목적으로 대기압에서 플라스마를 발생시키기 위한 dielectric barrier discharge(DBD) 구조의 평판형 플라스마 반응기 내에서 이온화된 아르곤 플라스마를 사용하였다. 플라스마 처리 공정변수인 처리 시간, 처리 RF-power, 아르곤 가스 유속을 변화시켜가며 접촉각을 측정하여 젖음성과 표면 자유 에너지 변화를 알아보았고, 필름 표면 위에 과산화물을 제대로 도입시키기 위해 플라스마 처리 공정변수를 최적화하였다. 대기압 플라스마 처리 시간 70초, RF-power 120 W, 아르곤 가스유속 6 liter per minute(LPM)에서 가장 높은 젖음성과 표면 자유 에너지 값을 보였고, 1,1-diphenyl-2-picrylhydrazyl(DPPH) 법을 사용하여 PU 필름의 표면에 생성된 과산화물의 농도를 정량한 결과, 처리 시간 30초, RF-power 80 W, 아르곤 가스유속 6 LPM의 플라스마 처리 조건에서 최대 2.1 nmol/cm2의 과산화물이 생성되었다.
Commercial polyurethane film (PU) was modified with Ar plasma ionized in dielectric barrier discharge (DBD) plate-type reactor under atmospheric pressure. We measured the change of the contact angle and the surface free energy with respect to the plasma treatment conditions such as treatment time, RF-power, and Ar gas flow rate. We also optimized the plasma treatment conditions to maximize the surface peroxide concentration. At the plasma treatment time of 70 sec, the power of 120 W and the Ar gas flow rate of 5 liter per minute (LPM), the best wettability and the highest surface free energy were obtained. The 1,1-diphenyl-2-picrylhydrazyl (DPPH) method confirmed that the surface peroxide concentration was about 2.1 nmol/cm2 at 80 W, 30 sec, 6 LPM.
Keywords:atmospheric pressure plasma;polyurethane film;surface free energy;DPPH method;peroxide
  1. Kang ET, Neoh KG, Li ZF, Tan KL, Liaw DJ, Polymer, 39(12), 2429 (1998) 
  2. Hegemann D, Brunner H, Oehr C, Nucl. Instrum. Methods Phys. Res. Sect. B-Beam Interact. Mater. Atoms, 208, 281 (2003) 
  3. Yang S, Gupta MC, Surf. Coat. Technol., 187, 172 (2004) 
  4. Dabhade RV, Bodas DS, Gangal SA, Sens. Actuators B-Chem., 98, 37 (2004) 
  5. Kim YS, Kwon OJ, Kim EH, Myung SW, Choi HS, HWAHAK KONGHAK, 41(2), 224 (2003)
  6. Park KD, Kim YH, Han DG, Ji KS, Rubber Technology, 3, 111 (2002)
  7. Ryan ME, Badyal JP, Macromolecules, 28(5), 1377 (1995) 
  8. Jang JH, Eom SI, Kim YH, J. Korean Fiber Society, 39, 100 (2002)
  9. Huang CY, Chen CL, Surf. Coat. Technol., 153, 194 (2002) 
  10. Yeom YH, Myung SW, Choi HS, Korean Chem. Eng. Res., 42(1), 89 (2004)
  11. Yamanoto T, Okubo M, Imai N, Mori Y, Plasma Chem. Plasma Process., 24, 1 (2004) 
  12. Liu C, Brown NMD, Meenan BJ, Surf. Sci., 575, 273 (2005) 
  13. Seebock R, Esrom H, Charbonnier M, Romand M, Plasmas Polym., 5, 103 (2000) 
  14. Noeske M, Degenhardt J, Strudthoff S, Lommatzsch U, Int. J. Adhes. Adhes., 24, 171 (2004) 
  15. Toshifuji J, Katsumata T, Takikawa H, Sakakibara T, Shimizu I, Surf. Coat. Technol., 171, 302 (2003)
  16. Chung YM, Jung MJ, Han JG, Lee MW, Kim YM, Thin Solid Films, 447-448, 354 (2004) 
  17. Beake BD, Ling JSG, Leggett G, J. Mater. Chem., 8, 1735 (1998) 
  18. Kang ET, Tan KL, Kato K, Uyama Y, Ikada Y, Macromolecules, 29(21), 6872 (1996) 
  19. Joo HS, Lim DH, Park YJ, Kim HJ, J. Adh. Inter., 6, 19 (2005)
  20. Zhang Y, Myung SW, Choi HS, Kim IH, Choi JH, J. Ind. Eng. Chem., 8(3), 236 (2002)
  21. Byun KH, Kang IK, Lim HS, Lee JH, Lee HB, Polym.(Korea), 17(2), 186 (1993)
  22. Suzuki M, Kishida A, Iwata H, Ikada Y, Macromolecules, 19, 1804 (1986) 
  23. Lu WL, Huang CY, Roan ML, Surf. Coat. Technol., 172, 251 (2003) 
  24. Oiseth SK, Korzer A, Kasemo B, Lausmaa J, Appl. Surf. Sci., 202, 92 (2002) 
  25. Hwang SN, Jeon BJ, Jung IH, J. Korean Ind. Eng. Chem., 9(3), 383 (1998)
  26. Ozdemir Y, Hasirci N, J. Mater. Sci. -Mater. Med., 13, 1147 (2002) 
  27. Nguyen LT, Sung NH, Suh NP, J. Polym. Sci. : Polym. Lett. Ed., 18, 541 (1980) 
  28. Kim MJ, Seo ED, Polym.(Korea), 26(2), 279 (2002)
  29. Seo Y, Polym. Sci. Technol., 13(6), 759 (2002)
  30. Kang IK, Kwon OH, Byun KH, J. Mater. Sci. -Mater. Med., 7, 135 (1996) 
  31. Ji LY, Kang ET, Neoh KG, Tan KL, React. Funct. Polym., 46(2), 145 (2000) 
  32. Zhang J, Cui CQ, Lim TB, Chem. Mater., 11, 1061 (1999) 
  33. Yasuda H, Plasma Polymerization, Academic Press, Orlando, p 295 (1985)
  34. Konig U, Nitschke M, Menning A, Eberth G, Pilz M, Arnhold C, Simon F, Adam G, Werner C, Colloids Surf. B: Biointerfaces, 24, 63 (2002) 
  35. Dogue ILJ, Mermiliod N, foerch R, Nucl. Instrum. Methods Phys. Res. Sect. B-Beam Interact. Mater. Atoms, 105, 164 (1998)