We apply a chip-scale chemical-mechanical polishing (CMP) modeling methodology to microelectromechanical systems (MEMS) fabrication. This methodology uses direct measurements of test wafers to extract and fit a semiempirical model to explain and simulate CMP for surface-machined polysilicon MEMS structures. A MEMS test mask incorporating unique MEMS features including large structures, irregular curves, and multiple test die is presented. Using the new test mask, we extract and evaluate a dual-material CMP model which is applicable to inlaid or damascene MEMS structures. The work validates our modeling methodology, previously developed for integrated circuit applications, and shows that the model can be extended into the arena of MEMS CMP. While the current model is able to capture trends in damascene MEMS CMP, it does not completely explain all of the observed nonuniformities. MEMS-centric design rules and structures motivate the need for further CMP model development and application. (c) 2005 The Electrochemical Society. All rights reserved.